PCB Manufacturing

Product Description

Our Competitive Advantages：

Comprehensive Manufacturing Capabilities
Full-process capabilities to meet diverse and complex PCB manufacturing needs.

Quality Assurance

Strict quality control systems ensuring top-tier reliability for every board.

Response Time

A dedicated team providing fast and efficient communication to your inquiries.

On-Time Delivery

Streamlined production management guaranteeing punctual delivery.

Expert Team & Exceptional Service

Experienced professionals committed to providing outstanding customer support.

Item	Mass Production	Prototype
MAX. Board Size	500mm * 2000mm	500mm * 2000mm
Board Thickness	0.075mm~5.3mm	<0.05mm or >5.3mm
Max. Copper Thickness	Inner Layer:9OZ	Iinner Layer:9OZ
Max. Copper Thickness	Outer Layer:9OZ	Outer Layer:9OZ
Min. Track Width	2mil / 0.05mm	2mil / 0.05mm
Min. Track Space	2mil / 0.05mm	2mil / 0.05mm
Min. Hole Size	4mil / 0.1mm	4mil / 0.1mm
Min. Laser Hole Size	3mil / 0.076mm	2mil / 0.05mm
PTH Dia Tolerance	±3mil/±76um	±2mil/±50um
Aspect Ratio	10:01	12:01
ImpedanceControl	±10%	±5%
HASL (including lead-free) thickness	PAD location SMT Pad:>3um	PAD location SMT Pad: >4um
HASL(LF)	Big Cu:>l um	Big Cu:>l.5um
Immersion Tin	0.8-1.2um	0.8-1.2um
Plating Tin	1~30um	30~100um
Immersion Gold	Ni:2-6um	Ni:5-10um
Immersion Gold	Au:0.03-0.4um	Au:0.2-0.4um
OSP	0.1-0.4um	0.25-0.4um
Goldfinger	Ni:3-10um	Ni:3-20um
Goldfinger	Au:0.03-5.0um	Au:0.03-5.0um
Flash Gold	Ni:1-6um	Ni:6-20um
Flash Gold	Au:0.03-5.0um	Au:0.03-5.0um
ENEPIG	Ni:2-5um Pd:0.01-0.10um Au:0.03-0.1um	Ni:2-8um Pd:0.01-0.10um Au:0.03-0.1um
MAX. Layers	18(Layers)	20(Layers)

Etching Production Line

Forming Machine

Automatic Screen Printing Machine

Automatic Inkjet Machine

Auto E-Tester

Hipot Tester

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