Quality Connects the World
Service Creates Value
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SMT Assembly
Process Capabilities：
Flexible Order Quantities
No minimum order quantity (MOQ). We support both rapid prototyping and mass production.
Unrestricted Process Complexity
Capable of handling all PCB process complexities and advanced board structures.
Double-Sided Soldering
Precision double-sided SMT assembly for high-density boards.
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Process Capabilities：
Flexible Order Quantities
No minimum order quantity (MOQ). We support both rapid prototyping and mass production.
Unrestricted Process Complexity
Capable of handling all PCB process complexities and advanced board structures.
Double-Sided Soldering
Precision double-sided SMT assembly for high-density boards.
SMT Assembly Process
Incoming Component Inspection (IQC)
Solder Paste Inspection (SPI)
Material Loading Verification
First Article Inspection (FAI)
In-Process / Finished Product Testing
Outgoing Quality Control (OQC)
SMT Assembly Capabilities
| Category | Parameter | Minimum | Maximum |
| PCB | Size (L x W x T, mm) | 50*40*0.38 | 510*460*4.2 |
| Weight | 1.8KG | ||
| Special Size | 610*510*4.2 | ||
| Material | FR-4, CEM-1, CEM-3, Aluminum Substrate, FPC | ||
| Surface Finish | HASL, OSP, ENIG, Hard Gold, Gold Fingers | ||
| Components | Chip & IC | 0402（1.0*0.5） | 22*22 |
| Special Size (Connectors) | 1.6*0.8 | 72mm | |
| BGA Pitch | 0.3mm | 1.0mm | |
| QFP Pitch | 0.3mm | 1.0mm | |