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MPT17 32mm glass transponder provides excellent performance and operates at a resonance frequency of 134.2 kHz. Specific products comply with
ISO 11784 and ISO 11785 global open standards.
MPT17 32mm glass transponder provides excellent performance and operates at a resonance frequency of 134.2 kHz. Specific products comply with
ISO 11784 and ISO 11785 global open standards.
MPT17 HDX Multipage Transponder/SemiTag
MPT17 32mm glass transponder provides excellent performance and operates at a resonance frequency of 134.2 kHz. Specific products comply with ISO 11784 and ISO 11785 global open standards. The MPT17 low-frequency transponder is manufactured using SemiTag tuning process patented technology, providing stable and consistent read/write performance. Before shipment, each transponder undergoes complete functional and parameter testing to meet the high quality standards expected from SemiTag products.
The transponder is suitable for a wide range of applications, including but not limited to wafer carrier management, access control, vehicle identification, container tracking, asset management, and waste management applications.

Fully Automatic RFID Magnetic Rod Winding and Spot Welding System |
Fully Automatic RFID Glass Tube Encapsulation and Inspection Equipment |
Fully Automatic RFID e-Unit Winding and Spot Welding Equipment |
Semiconductor Wafer Management Chip Equipment |
Automatic Winding Machine |
Automatic Spot Welding Machine |
Application Example:

Holder and carrier are connected using ultrasonic welding technology.
| Comparison Item | Ultrasonic Welding | Traditional Adhesive |
| Production Efficiency | Fast processing completion and high production efficiency. | Requires longer curing time, resulting in lower production efficiency. |
| Welding Tensile Strength and Sealing Performance | High welding tensile strength, excellent sealing performance, and completely waterproof. | Performance is affected by multiple factors including adhesive type and curing conditions. Strength is lower, with risk of detachment, and complete waterproofing cannot be guaranteed. |
| Operational Safety | Simple equipment operation with a high level of automation, reducing operational errors. | Manual adhesive operation has lower efficiency and may cause Holder bonding position deviation. |
| Applicability | Holder materials can be customized according to customer carrier material requirements. | Material matching is limited and cannot fully adapt to different carrier materials. |
| Appearance | Consistent overall appearance and fully integrated with the carrier. | Cannot ensure consistent appearance; adhesive marks may remain on the carrier surface. |
| Environmental Impact | No glue, solvents, or other chemicals are required during welding, avoiding harmful emissions and reducing environmental pollution. | Adhesives contain chemicals such as glue and solvents, which may release harmful gases during production and use, causing environmental pollution. |
Application Coverage
The above applications can fully cover 4-inch, 6-inch, 8-inch, and 12-inch semiconductor carriers without RFID TAG positions.